Glass
Lamination (VIA bond process)
The
VIA bond process is an excellent solution for users that require
optimum power consumption, without compromising view ability
in high ambient light due to a protective window or touchscreen.
•
Display window or touch is bonded to TFT
• Filling of air-gap with silicon optically matches
window
• Internal reflections eliminated
• Bond cures with time - greater resistance to shock
• Available up to 37” size
